AMDVendor documented

Instinct MI325X

CDNA 3 · CDNA 3 (refresh) · OAM · 2024

MI300X refreshed with 256 GB HBM3e and 6 TB/s — the memory-capacity leader, aimed at fitting the largest models per GPU.

LLM trainingLLM inferenceFine-tuningHPCMultimodal
Precision fingerprint
6432t3216BF168i8
Memory

256 GB

HBM3e

Bandwidth

6 TB/s

peak

TDP

1000 W

air or liquid

Max model

~110B

FP16, planning est.

Compute throughput

FP64163.4 TFLOPS
FP32163.4 TFLOPS
TF32—
FP161.31 PFLOPS
BF161.31 PFLOPS
FP82.62 PFLOPS
INT82.62 PFLOPS

Platform & software

InterconnectInfinity Fabric — 896 GB/s
PCIePCIe 5.0 x16
Coolingair or liquid
MIGNot supported
PartitioningCompute + memory partitioning, SR-IOV
VirtualizationSR-IOV
FrameworksROCm, RCCL, vLLM (ROCm), MIOpen
Availabilitybare-metal
Known limitations
  • ·1000 W raises cooling requirements
  • ·ROCm ecosystem still maturing
Related GPUs
NVIDIA

H100 SXM5

80 GB · 989 TFLOPS FP16

NVIDIA

H100 PCIe

80 GB · 756 TFLOPS FP16

NVIDIA

H100 NVL

94 GB · 989 TFLOPS FP16