NVIDIAEstimated
B100
Blackwell · Blackwell · SXM · 2024
700 W Blackwell for air-cooled or retrofit deployments. Trades peak throughput for easier facility fit versus B200.
LLM trainingLLM inferenceMultimodalHPC
Precision fingerprint
6432t3216BF168i8
Memory
192 GB
HBM3e
Bandwidth
8 TB/s
peak
TDP
700 W
air or liquid
Max model
~80B
FP16, planning est.
Compute throughput
| FP64 | 30 TFLOPS |
| FP32 | 30 TFLOPS |
| TF32 | 875 TFLOPS |
| FP16 | 1.75 PFLOPS |
| BF16 | 1.75 PFLOPS |
| FP8 | 3.50 PFLOPS |
| INT8 | 3.50 PFLOPS |
Platform & software
InterconnectNVLink 5 — 1.8 TB/s
PCIePCIe 6.0 x16
Coolingair or liquid
MIGSupported
PartitioningMIG
VirtualizationMIG, vGPU
FrameworksCUDA, TensorRT-LLM, Triton, NeMo, vLLM
Availabilitybare-metal
Known limitations
- ·Power-capped variant of B200 — lower peak throughput